warpage是什么意思   warpage怎么读

warpage单词基本解析：

warpage变化用词：

warpage英英释义：

warpage中文词源：

warpage用法和例句：

warpage

The reported Warpage values may be lower than actual due to voiding.

/纪录的弯曲度数值可能比实际应用的低。

20% Glass bead filled polybutylene terephthalate resin for injection molding.It has isotropic properties and low warpage characteristics.

20 %玻璃微珠填充聚对苯二甲酸丁二酯树脂注塑。

20% Glass fiber reinforced polybutylene terephthalate alloy for injection molding.It has improved surface aesthetics, excellent dimensional stability and low warpage characteristics.

20 %玻璃纤维增强，黑色聚对苯二甲酸丁二酯合金注塑成型。

PCB warpage

PCB板翘曲

EXPERIMENTAL STUDY ON WARPAGE RULE OF UNSYMMETRIC COMPOSITE LAMINATES

不对称铺层复合材料变形规律的实验研究

This thesis is focus on the problem of warpage in flip-chip package due to the CTE mismatch between die, substrate, and bump using various underfill materials.

中文摘要本论文针对覆晶封装制程中，因为晶片、基板、凸块和底胶材料都之不同，当温度变化时，所产生的热膨胀效应使得整个封装出现翘曲变形的现象。

The main aim of this paper is to study for the warpage and von Mises stress of PBGA package caused by the variations of mechanical properties of materials in IR-reflow process.

中文摘要目前一般封装体之封装材料，即使是同一厂商所制造出相同名称的产品，其材料性质亦有差异存在，因此探讨材料性质变异对于封装体的影响是有其必要性的。

The Kriging model provided the approximate mapping relationship between warpage and the parameters, replacing the warpage analysis of Moldflow in the optimization.

以手机壳制品为例;用模具温度、熔体温度、注射时间和保压压力做设计变量;

Taking the forming of computer case panel as an example,the process of the filling,cooling and warpage of the plastics parts in the injection molding were simulated by means of MPI software.

以电脑机箱面板为实例,使用MPI软件对塑料件注射过程中的填充、冷却、翘曲情况进行模拟。

Using Moldflow software to make CAE simulation of the shrinkage and warpage of the product.

依据采集的模拟数据进行分析,得出注射模的型腔尺寸补偿方案,用于指导型腔尺寸的修整。

Keywords front bumper;parameters of injection molding;warpage;injection mould;

关键词前保险杠;成型工艺参数;翘曲;注射模;

Keywords precise injection;process parameter;shrinkage;warpage;orthogonal test;

关键词精密注射;工艺参数;收缩变形;翘曲变形;正交试验;

the effect of the cooling time on the warpage was not obvious.

冷却时间对翘曲量的影响比较小。

STUDY ON THE INTERLAMINAR STRESS AND WARPAGE DEFORMATION IN LAMINATED OBJECT MANUFACTURING

分层实体制造中层间应力和翘曲变形的研究

The results showed the warpage increased with the rise of the temperature and decreased with the decrease of the injection time;

分析结果表明：产品的翘曲量随模温升高，注射时间减短而减小；

The initial stress of wafer from the manufacturing process is calculated using process modeling.The effect of the lift-off procedure on warpage is simulated using 2-D and 3-D models, respectively.

利用制程模拟使模型具有制程后因热膨胀系数不匹配所造成之应力，并分别以二维及三维模型，分析不同剥离方法对翘曲量之影响。

The wafer warpage curve is 2nd order polynomial, therefore the warpage results of a 2” wafer can be calculated from smaller models to reduce calculation time.

利用晶圆翘曲为二次多项式曲线之关系，两吋晶圆之翘曲可由较小半径模型之翘曲求得，以节省计算时间。

heat warpage test

加热畸变试验

Warpage analysis is also a very useful tool for investigating practical solutions for existing mouldings that have distortion problems.

变形分析对现有的产品存在的变形问题的调查和解决也是非常有用的。

The shaped errors have many forms, including warpage deformation, Stair-stepping effect and so on in fused deposition modeling (FDM).

在熔融堆积成形制造中，形状误差有翘曲变形、台阶效应等形式。

On the basis of general Hele-Shaw model,the effect of processing parameters on the warpage in co-injection molding and the mechanism of warpage were studied.

基于Hele-shaw模型,通过有限元数值模拟技术,研究了工艺参数对共注成型制品翘曲变形影响规律,并根据注射成型原理揭示了翘曲变形的产生机理。

Keywords brick;roller-hearth kiln;warpage;burning;

墙地砖;辊道窑;上翘;烧成;

Keywords multi-layer parquet;adhesive;PUR;moisture-curing;warpage;

多层复合地板;胶黏剂;聚氨酯;湿固化;翘曲;

Study the warpage of the product and put compensate on mould to defeat the warpage.

学习研究陶瓷件的变形，并把预变形的补偿计算到模具里面。

The lead frame with the opening in die pad can significantly improve the package warpage and die stresses.

导线架晶片座开槽型式，对构装翘曲及晶片应力也有明显改善效果。

Adjusting delay time and gas pressure can reduce the warpage of the part.

工艺上可以通过调整延迟时间和气体压力来减小产品的变形量。

A predictive model for warpage is created using feed forward artificial neural network exploiting finite element analysis results.

建立了使用有限元分析结果的具有提前输入（功能）的人造神经网络的扭曲预制模型。

Under certain conditions, the calculating formula of interlayer stress and the stress-distributing diagram in cut planes are provided, and the mathematical model for warpage deformation calculation is also established.

建立了翘曲变形的数学模型，讨论了各种工艺参数（层数、扫描线长、成型室温度、层厚等）对翘曲变形量的影响。

CAE Analysis of Warpage Deflection for Battery Cover of Mobile Phone

手机电池盖的CAE翘曲变形分析

distortion, warpage, warp, twist, bend

扭曲。变形。曲解。弯曲。翘曲。

Speckle projection correlation technique for measuring warpage of mobile-phone chip

投影散斑相关方法测量芯片翘曲度

Through genetic algorithm, the injection molding parameters that affect thin-wall mould warpage,namely the mold temperature, melt temperature, filling pressure, packing pres...

按该参数进行试验,效果良好,可以有效地减小薄壳塑件翘曲变形,其试验数值与计算数值基本相符,说明所提出的方法是可行的。

Summary：The theory of the Newton ring method is analyzed and the chip warpage is measured by use of the Newton ring method.

摘要：分析了牛顿环法的测量原理，利用牛顿环法对芯片翘曲度进行了测量。

An optimized ram speed profile fully uses the friction heat to keep the best flow characteristics, which corrects many of the fill and warpage problems.

最适化螺杆速度充分运用摩擦热，将塑流保持在最佳状态。许多充填和翘曲的问题也就迎刃而解。

First, design die bond process because Film BGA substrate must overcome warpage issue, next, use TAGU-CHI DOE method, fillet height control was quality characteristic and optimal parameter design.

本文即先从黏晶制程的机台机构上,设计黏晶制程,克服基板翘曲的现象，再使用工业界常使用的田口式品质设计方法，将填充胶的控制列为品质特性，然后最佳化参数设计。

In the numerical simulation of injection molding, FEM is used to analyze the process of flow, packing and warpage, which finally come down to the solution of sparse linear equation.

本文基于有限元方程组系数矩阵的稀疏性、对称性等特性，采用了链表式存储结构，最大限度地节约了存储空间，提高了求解效率。

To understand the mechanics of wafer warpage, research is performed on the effect of the lift-off procedure and material thickness on wafer warpage.

本研究进一步为了解晶圆翘曲的力学特性，研究雷射剥离过程及材料厚度，对氮化镓发光二极体晶圆翘曲之影响。

And the first normal stress difference near the exit of die increases with relaxation time increasing which result in the extrusion die swell and the warpage of side walls increasing.

此外，随着松弛时间的增大，口模出口附近气辅段的第一法向应力差增加，从而导致离模膨胀和两侧壁向内的翘曲变形均增大。

Fin ger effect of gas is an important factor that can lead to warpage.

气体手指效应也是造成产品变形的一个重要因素;

WIT's ability to pack out a part consistently can reduce sinks and warpage while lessening the degree of mold texturing required.

水辅注射能够在不苛责模具型腔表面质地的前提下稳定保压消除塌陷和翘曲。

Keywords injection;four elements mechanical model;internal stress;warpage;

注塑;四元件力学模型;内应力;翘曲;

Keywords injection-molded parts;residual stress;warpage;

注塑件;残余应力;翘曲变形;

Warpage optimization and influence factor analysis of injection-molding

注塑制品的翘曲优化及影响因素分析

Error Analysis of Finite Element Numerical Simulation in the Warpage of Injection Molded Parts

注塑制品翘曲变形有限元数值模拟的误差分析

Keywords injection molding;MPI;warpage;optimization;

注塑成型;MPI;翘曲变形;优化;

Keywords injection molding;residual stress;warpage;numerical simulation;

注射成型;残余应力;翘曲;数值模拟;

Keywords injection molding;warpage;simulation;computer software;acrylonitril-buta-diene-styrene copolymer;

注射成型;翘曲变形;模拟分析计;算机软件;丙烯腈-丁二烯-苯乙烯共聚物;

Keywords injection molding simulation;factor;level;shrinkage and warpage;

注射成型模拟;因素;水平;收缩与翘曲;

Keywords temperature field;finite element;residual stress;warpage;

温度场;有限元;残余应力;翘曲变形;

sintering warpage

烧结扭曲 烧结变形

Shrinkage and warpage of thermoplastic material part

热塑性材料产品的收缩与翘曲

Thermo-mechanical design is equally important when addressing complex substrates, warpage issues, and thermo-mechanical modeling.

热机械设计同样重要的是，在处理复杂的基板，翘曲的问题，和热机械模型。

Keywords thermal residual stress;warpage;injection molding;

热残余应力;翘曲;注塑件;

heating warpage test

热移定性试验

feature warpage

特征翘曲度

Features Good thermal reliability and moisture resistance, lower warpage, good mechanical properties and electrical properties.

特性 良好的耐热性、耐湿性、平整性，良好的机械性能和电性能。

20% Glass fiber reinforced, black polybutylene terephthalate alloy for injection molding. It has improved surface aesthetics, excellent dimensional stability and low warpage characteristics.

玻璃纤维增强，黑色聚对苯二甲酸丁二酯合金注塑成型。它改进表面美观，良好的尺寸稳定性和低翘曲的特点。

The step to analyze warpage deformation by CAE is given with air condition damper vane as example.

用有限元方法研究了温度场、压力场对注塑件残余应力及翘曲变形的影响。

Electronic Package Warpage Simulated with Numerical Method

电子封装器件翘曲问题的数值分析

30% Glass fiber reinforced, black polybutylene terephthalate alloy for injection molding. It has improved surface aesthetics, excellent dimensional stability and low warpage characteristics.

的玻璃纤维增强，黑色聚对苯二甲酸丁二酯合金注塑成型。它改进表面美观，良好的尺寸稳定性和低翘曲的特点。

The press utilizes an automatic cure cycle control which supplies heat/pressure/vacuum.The presses are coupled with a controlled cooling cycle under pressure to reduce warpage.

真空压机通过制动加热循环控制系统，提供热量/压力/真空度，压机通过冷却控制系统在一定压力下进行板冷却，减小翘曲发生。

s Experimental relations between 2 kinds of gate and 7 kinds of processing parameters and the warpage of HDPE plate were described.

研究了两种模具、七种成型工艺参数与高密度聚乙烯平板翘曲变形之间的关系。

THE REASON OF WARPAGE OF BRICK AND THE WAY TO DEAL WITH IT

砖体上翘的成因及对策初探

The results show that group of ZrB2 of sintering warpage is P6/mmm ,after several Rietveld refining ,the parameters of ZrB2 cell and the position of atoms Zr and B are obtained.

确定了原位反应生成的ZrB2属P6/mmm空间群,然后通过里德瓦尔(Rietveld)精修得到了ZrB2 晶格常数,并最终得到了原位生成的ZrB2晶体的原子位置。

The results show that the stacking sequence,thickness of the laminates and curing temperature have great influence on the warpage,while the geometry of the ...

结果表明,铺层顺序、构件厚度和固化温度对不对称铺层复合材料的变形有显著影响,而构件尺寸对变形曲率影响较小。

The results showed that the warpage decreased with the decrease of mold temperature,nozzle temperature and hold preasure.

结果表明,随着模具温度、喷嘴温度和保压压力的降低,制品的翘曲减小;

glost warpage

翘曲, 弯曲; 畸变

Application of Warpage Modified Four-node Element in One-step Forming Simulation of Certain Automobile Oil Box

翘曲修正曲面展开四节点单元在某汽车油底壳快速成形模拟中的应用

warpage and deformation

翘曲变形

Warpage simulation was based on a modified flat model with surface mesh, which avoided the deficiencies of traditional flat models.Validation was carried out by comparing with application data.

翘曲变形模拟在传统的平板壳元模型基础上，提出了基于制品表面网格的改进模型，避免了使用传统板壳模型的缺陷。

warpage evaluation

翘曲变形评价

warpage amount

翘曲变形量

warpage degree

翘曲度

Furthermore, the models with the best geometric control factors being obtained to undertake processing parameters optimization of Taguchi method, improvement of warpage will be further obtained.

而后再更进一步以所得到之最佳几何控制因子组合来进行制程因子之田口最佳化，藉此获得更进一步的塑件翘曲量之改善。

Testing methods for warpage of refractory bricks

耐火砖翘曲测定方法

The Analysis of the Warpage of the Thin-Wall Plastic Parts and the Optimization of the Technological Parameters

薄壳塑件翘曲变形分析与工艺参数优化

wafer warpage

薄片弯曲

Surface smoothness and low warpage.

表面平滑,低翘曲性。

Causes and Prevention of Copper Clad Laminate and PCB Warpage

覆铜板和PCB板翘曲成因与预防措施

Copper Clad Laminate and PCB Warpage Test Method

覆铜板和PCB翘曲度的检测方法

The resulting benefits are high stiffness and load bearing at low weights and with low warpage.
最终带给产品的好处是在低重量和低翘曲情况下体现出的高刚性和承载能力。

To understand the mechanics of wafer warpage, research is performed on the effect of the lift-off procedure and material thickness on wafer warpage.
本研究进一步为了解晶圆翘曲的力学特性，研究雷射剥离过程及材料厚度，对氮化镓发光二极体晶圆翘曲之影响。