electroless是什么意思   electroless怎么读

electroless单词基本解析：

electroless变化用词：

electroless英英释义：

electroless中文词源：

electroless用法和例句：

electroless

It is well known that direct copper plating on ABS plastics has found widely industrial application for eliminating electroless plating.

ABS塑料直接电镀过程省略了化学镀,是塑料电镀史上的重大突破。

Impact Abrasive Wear of Electroless Ni-P Coating

Ni-P化学镀层的冲击磨粒磨损性能研究

The sequence of NIRUNA ENIG corresponds with common processes and can be adapted to electroless Nickel Gold plants after adjustment.

Niruna沉镍金流程程序相应于一般沉镍金流程,经调整后可被改用于此流程.

Yosi, S. D., Dubin, V. and Angyal, M., “Electroless copper deposition for ULSI,” Thin Solid Films, Vol. 262, pp. 93-103, 1995.

“半导体制程技术导论”，台湾培生教育出版股份有限公司，美国，第473-474页，2001

One is fluidized-bed type reduction (FB-reduction) with the precursor of CuCl powder, and the other is electroless plating in which formaldehyde was served as a reducing agent.

一种是以氯化亚铜为先驱物的流体化还原法，另外一种是以甲醛为还原剂的无电镀法。

It is not an Electroless Nickel Plating.

不是无电镍电镀。

Additives are indispensable agents for both electroplating and electroless plating.

不论是电镀或是无电电镀，添加剂都是不可或缺的药剂。

Satisfactory polishing surface cannot be obtained on stretched stainless steel parts by traditional electroless polishing process.

不锈钢拉伸工件采用常规的化学抛光工艺不能达到理想的效果。

Similar to the mechanism of electroless plating,electroless polymerization of aniline involves local and spontaneous electrochemical reactions on only substrate.

与化学镀的原理类似，苯胺的无电聚合反应过程包含阴极半反应和阳极半反应两个电化学反应。

Electroless deposition has been widely used for surface metallization of nonconducting materials, such as PCB and specific cloth of electromagnetic interference (EMI).

为了非导体表面金属化，无电电镀已被广泛地使用，例如印刷电路板以及电磁波干扰之特定织布的制造。

Electroless Ni-Cu-P ternary alloy deposits are prepared by addition of cupric sulfate and complex in eletroless Ni-P alloy plating bath.

为提高钕铁硼表面镀层的耐蚀性,使其具有更高的经济附加值,采用在化学镀镍磷合金液中添加适量的铜离子及其复合络合剂,制得镍铜磷三元合金。

Electroless plating (EP) method was supposed to replace the conventional physical vapor deposition (PVD) during MIC/MILC process.

主要是利用无电镀镍之方式取代传统物理气相蒸镀方式来镀覆金属层。

Electroless Bismuth Plating in Dimethylsulfoxide

二甲基亚砜溶剂中化学镀铋的研究

The major products for liquid-operation for separation, and chemical corrosive solution, stirring, recycling, which are widely used in electroplating, electroless plating, phosphating, electronics and use of chemical and other industries.

产品主要用于液-因分离和化学腐蚀性溶液运转、搅拌、循环，广泛应用于电镀、化学镀、磷化、电子、制版、化工等行业中。

Electroless plating processes for surface metallization of plastics, such as ABS, polypropylene (PP), polystyrene (PS) and polyvinyl chloride (PVC) were introduced.

介绍了ABS、聚丙烯、聚苯乙烯、聚氯乙烯等塑料的化学镀表面金属化工艺。

The latest developed electroless spinel ferrite films plating technology is introduced. The mechanism of deposition is discussed in detail, and applications are illustrated.

介绍了最新的铁氧体磁性薄膜的化学镀技术、沉积机理及其应用。

Mechanism, procedures and operation parameters of selective electroless nickel plating and gold immersion (SENi/IG) were introduced.

介绍了选择性化学镀镍、浸金工艺的原理、流程和操作参数。

Electroless plating process and subsequent electroplating process of diamond are described as well as the operation hints in practice.

介绍了金刚石表面化学镀和电镀金属技术，提出实际生产中存在的问题和解决办法。

The distribution as well as the content of the particles in N-P electroless codeposits is determined by means of conventional stereome-tric metallograph.

介绍用普通的体视金相法,可以很容易地测定化学复合镀层中固体微粒的分布形态及其含量。

Current research of failure mechanism and physics model of PTH in manufacture process including drilling, electroless plating and electroplate were reviewed.

从钻孔、化学镀铜、电镀三个主要工艺入手，对目前制造过程镀通孔失效的机理与物理模型的研究现状进行总结。

Acid electroless nickel phosphorus plating on PZT ceramic was studied with hypophosphite as a reducing agent.

以次亚磷酸钠为还原剂,在压电陶瓷表面进行酸性化学镀镍磷。

A is chosen as an excellent electroless nickel bath stabilizer,which can not only stabilize the bath very well but also bring an excellent corrosinon resistance to the coatings.

优选了一种不仅能使镀液稳定性能良好,而且镀层耐蚀性能优异的药品A作为化学镀镍液的稳定剂。

The majority of low temperature ulrtasonic electroless nickel coating is amorphous, but it is mixed with microlites.The common electroless nickel coating is typically amorphous.

低温超声波化学镀镍层主要为非晶态， 夹有少量微晶， 而常规化学镀镍层则为典型的非晶态。

The thickness nonuniformity of the immersion-gold layer in electroless nickel plating and the causes leading to the nonuniformity were explored.

分析了化学镀镍浸金过程中金层厚度不均的现象及其产生的原因。

Donal W, Baudrand C, Stewart R. Electroless Nickel Plating on Zinc Die Castings[J]. Plating and Surface Finishing,1987(7):24.

刘珍,李素琴,刘燕萍.锌合金压铸件化学镀镍磷合金[J].材料保护,1997,30(1):34.

Good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability.

利用化学镀镍作阻挡层，化学镀金作可焊层，可得到良好的焊接效果。

Electroless composite plating is one of new surface process techniques.

化学复合镀是一种新型表面处理技术。

As a new surface-treatment method, electroless plating is widely applied to various fields.

化学镀作为一种新兴的表面处理技术,已经广泛应用于各个领域。

Electroless plated cobalt-phosphorus film has good magnetic properties.

化学镀钴磷薄膜具有优良的磁学性能。

Electroless copper depositing processess are controlled by the kinetics of formal dehyde oxidation reaction, which donate electron for the cathodic reduction of cupric ions.

化学镀铜反应受甲醛氧化过程动力学控制，甲醛氧化为铜离子还原提供电子。

The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.

化学镀铜层的显微结构受基体的显著影响。

Electroless copper plating is a non-electrolytic method of deposition from solution.

化学镀铜是指不使用电解方法而从槽液中沉积镀铜。

A Cyclical Research on Electroless Ni-P Bath

化学镀镍-磷液的周期循环研究

Study of the Accelerating Agent for Electroless Ni

化学镀镍加速剂的研究

Electroless Nickel Plating(ENP) have been widely applied in actual production with its advantages such as simple processing, low-cost, uniform thickeness and large-area plating.

化学镀镍方法以其工艺简便、成本低厚度均匀,可大面积镀覆等优点,已广泛应用于实际生产中,然而随着技术不断发展与实际生产工程中需要,又逐步发展具有特定功能的复合镀层。

Electroless plating of nickel is an advanced metalizing PZT ceramic technology.Adhesion of nickel is a key quality factor of the electrode layer.

化学镀镍是一种先进的PZT陶瓷覆镀电极层的技术,其镍层附着力大小是影响电极层质量的关键因素。

Electroless nickel coating is an important measure for protection of magnesi am alloy.

化学镀镍是镁合金保护的重要手段。

When the electroless nickel bath works, the concentration of Ni 2+ , HPO 2 and H + is changed continuously.In order to maintain its stability, the bath must be analyzed on line and supplied rigorous.

化学镀镍液在使用过程中无论是镍离子、次磷酸钠、氢离子等的浓度都在不停的变化着,要想获得性能稳定的镀液,必须对溶液进行严格的在线分析与补充。

With the raise of pH value of electroless nickel plating solution, content of phosphorus in deposit was lowered, and moreover, Ni(OH)_2 was probably precipitated and mingled with Ni-P deposit which resulted in ascension of resistance.

化学镀镍溶液pH值升高,镀层磷含量降低,同时可能生成Ni(OH)2沉淀夹杂在镀层中,从而使电阻升高;

Cost and Price for Electroless Ni plating

化学镀镍的成本与价格

"Is SPC used for Desmear and Electroless process ? Is the corrective action taken for the out of control status?

去胶渣与化学沉铜制程是否使用SPC？超出管控要求时，是否采取相应的改善措施？"

Meanwhile, initial research on the NaH2PO2 concentration in the bath, shows that it can greatly improve the deposition rate of electroless tin and has the effect of positive promoting reaction dynamics too.

同时，对镀液中次磷酸钠的初步研究表明：它能明显提高锡的沉积速度，对反应动力学有着积极的促进作用。

Xiang YH, Hu WB, Liu XK, etc . Initial Deposition Mechanism of Electroless Nickel Plating on Magnesium Alloys [J]. Trans IMF, 2001, 79 (1): 30-32.

向阳辉胡文彬沈彬等.镁合金化学镀的初始沉积机制[J].上海交通大学学报,2000,34(12):16381640.

Solid lubricant film can be formed in deposits containing PTFE (with electroless or electrodeposition processes).It features good lubricity, less friction coefficient, nonadhesion and easy stripping.

含有PTFE微粒的镀层（无电解镀、电沉积）可形成固体润滑膜，具有润滑性好、摩擦系数小、不粘着、易脱模等特性。

A compound brightener agent consisting of sodium benzene sulphinate,pyridine and sodium allyl sulphonate was added in the nickel-phosphorus electroless plating bath,and bright coatings can be obtained from the bath.

在化学镀N i-P合金镀液中加入由苯亚磺酸钠、吡啶和烯丙基磺酸钠组成的复合光亮剂,得到了光亮的化学镀层。

Specific monoamine may be added as accelerator into electroless copper plating solution to perform high speed deposition.

在化学镀铜液中添加有特效的一元胺作加速剂可以获得特别快的沉积速度.

A new brightening agent EN65D is used in the electroless plating Nickel Phosioporuos process, and the entire bright coating is obtained.

在化学镀镍磷合金工艺中 ,使用了一种新型的镀镍光亮剂EN6 5D ,获得了全光亮的镀层。

In the course of electroless nickel plating,flow injection analysis(FIA)spectrophotometry was established for real-time on-line analysis of nickel in the bath.

在化学镀镍过程中 ,建立了流动注射光度法在线实时监测化学镀镍浴中镍浓度随时间变化的方法。

In electroless polymerization,aniline molecules were oxidized to form Pn film by soluble oxygen on the catalytic surface of Pt or Pd substrate without the supply of electric current.

在没有外电流的情况下，溶液中的苯胺分子在具有催化活性的铂或钯基底表面上被溶解氧氧化为聚苯胺膜。

On Perkin Elmer TMA-7,the determination of thermal expansion of three electroless Ni-P deposits with different P content,which was 13.0,11.55 and 8.2wt%respectively,was carried out.

在珀金－埃尔默热机分析仪TMA－7上，对3种成分的化学镀Ni－P镀层的热膨胀进行了测定，3种成分分别为含磷量13.0，11.55和8.2wt%。

Under the same heating rate, the crystallization temperature of Ni P UFD composite coating is lower than that of Ni P coating, while the peak temperature of the two electroless coating are well matched.

在相同的加热速率下 ,Ni P UFD复合镀层晶化的起始温度均低于Ni P镀层 ,但峰值温度与Ni P镀层相当 ;

Compared with 1Cr18Ni9 stainless steel, the electroless deposition Ni-Cu-P ternary alloy has much better corrosion resistance under the same condition of simulating acid-corrosion.

在相同的模拟酸性腐蚀条件下,Ni-Cu-P三元合金化学镀层与1Cr18Ni9不锈钢相比,具有更加良好的耐腐蚀性能。

Electroless Ag plating on the polystyrene (PS) microspheres core-shell material possesses the characters of light quality of polystyrene, easy microspheres size controll, and Ag electric conduction.

在聚苯乙烯(PS)微球表面进行化学镀银制得的核壳结构微球,可同时具有聚苯乙烯轻质、粒径可控以及金属银导电的特点。

Satisfactory colored-films on iron craftworks were obtained by coloring process of electroless Cu plating at room temperature and chemical coloring in turn.

在铁制工艺品上先进行常温化学镀铜然后进行着色处理,获得了效果满意的着色层。

By forming a bright,flat and compact nickel coating on Mg alloys surface through electroless nickel plating,the corrosion resistance of Mg alloys can be effectively improved.

在镁合金表面进行化学镀镍,生成一层光滑、平整、致密的镍镀层,能有效地提高镁合金的耐蚀性能。

On the base of the technology of electroless Ni plating on PET fabric,the electromagnetic shielding dacron fabric of different increasing weight rate was developed.

基于织物化学镀技术,开发出不同增重率的化学镀镍电磁屏蔽涤纶织物。

Sidelight optical fiber are fixed in water tank. Athermal and electroless optical fiber can solve the problems of water-related decoration.

安装在水池,无热,无电的光纤解决了水装饰的问题。

Triethanolamine was considered as a desirable complexing agent to reduce phosphorus content in electroless nickel deposits applied on polyurethane foam substrate.

对于以聚氨酯海绵为基体的化学镀镍，研究认为，三乙醇胺是较好的选择。

The mecha-nism of electroless composite plating and the dispersion mechanism of surfactant in electroless composite plating were discussed.

对化学复合镀机理及表面活性剂在化学复合镀中的分散机理进行了探讨。

The performances of Ni three-part alloy layer of elec-troless Ni-P and Ni-B plating and alloy layer of compound electroless Ni plating were described and their application in petrochemical industry was introduced.

对化学镀Ni-P、Ni-B、镍三元合金镀层及其复合化学镍合金镀层的特性进行了论述,对化学镀镍合金在石化工业中的应用进行了介绍.

Treating on PET fabric using alkali,and studied the effect of concentration sensitize solution and activation solution to electroless process.

对涤纶织物进行碱减量处理、敏化、活化后进行化学镀镍。

Electroless nickel plating on magnesium-lithium alloy was studied,and an appropriate pretreatment was determined.

对镁锂合金化学镀镍进行了研究,确定了合适的前处理工艺。

The thickness nonuniformity of the immersion-gold layer in the electroless nickel plating process was attributed to two main aspects,...

导致金厚不均的原因有两种情况,一种是电势影响,二是双极性效应。

After oxidation treatment, the flake graphite powders were electrolessly copper plated followed by electroless silver plating.

将普通片状石墨粉末经过氧化处理后,先进行化学镀铜再进行化学镀银。

The outer surface of pin is nanocrystallized and the inner surface of bush is carried out Ni-P electroless plating.

将销轴外表面纳米化,套筒内表面进行N i-P化学镀处理,组装成链条,进行了链条磨损性能实验。

Electroless Deposited Coatings of EMI/RFI Shielding

屏蔽EMI/RFI的化学镀层

Electroless plating method is applied to metallize the AlN sbstrate.

应用化学镀镍的方法实现了氮化铝的金属化。

Electrodialysis can be used to regenerate electroless nickel plating baths.

应用电渗析技术,再生化学镀镍老化液以降低镀液成本,减少环境污染。

Study of electroless plating for copper hohlraum fabrication[J].

引用该论文 万小波,张林,周兰,肖江.

Electroless plating and characteristics of hohlraum Cu target[J].

引用该论文 刘继光,万小波,付渠,周兰,宋红文,肖江.

Fairweather, W.A., “Electroless nickel plating of magnesium,” Trans.IMF., 75(3), pp. 113-117, 1997.

张永君，”镁及镁合金阳极氧化工业综述”，材料保护，第34卷，第9期，第24-26页，2001。

Research on Colored Electroless Ni-P Plating

彩色化学镀镍磷合金镀层研究

In this paper, some confusingphenomena of electroless plating of nickel on thecurrent domestic market are criticized and properpratcties with this new high technology aresuggested.

批评了国内化学镀市场上日前存在的某些混乱现象，提出了正确使用化学镀镍高新技术的几点建议。

It was found that the brightener BOZ took part in the oxidation-reduction reaction during the electroless plating process, and the decomposition of BOZ was characterized by a quasi first-class reaction in terms of the reaction kinetics.

探讨了BOZ在反应体系中的作用机理。 结果表明,BOZ不仅是光亮剂,而且参与该体系的氧化还原反应,BOZ分解反应的宏观动力学表现为准一级;

The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed.

探讨了次亚磷酸钠体系化学镀镍沉积机理。

Abstract: Surface metallization on alumina ceramic was realized by electroless copper plating.Microstructure of the metallized copper layer before and after heat treatment was studied by SEM.

摘 要: 通过化学镀铜在氧化铝陶瓷基板表面实现了金属化，采用SEM研究了镀铜层表面微观形貌以及热处理的影响，检测分析了金属化镀层附着力。

On the basis of morphologic observation, composition detection and structure analysis, the depositing process of electroless Ni-B coatings was investigated.

摘要基于化学镀镍硼合金镀层的组织形态和成分、结构，探讨了镍硼合金镀层的沉积规律。

Wood is one of the important regenerated natural resources.Good electroconductivity and decoration of metalized wood are realized by the method of electroless plating.

摘要木材是重要的再生资源，化学镀的木材可以具有良好的导电性和装饰性。

A new procedure of surface activation without using palladium salt was proposed for electroless nickel plating on carbon nanotubes.

摘要本文提出碳纳米管表面无钯活化的化学镀镍方法。

The effects of electroless nickel plating on the particles morphology and the electrochemical properties of low-Co hydrogen storage alloy were investigated.

摘要研究了化学镀镍对低钴贮氢合金粉末颗粒形态和电化学性能的影响。